Datacon 2200 Evo Manual Pdf Kenya [best] May 2026
While there is no single public PDF document titled "Datacon 2200 evo manual pdf kenya," this guide provides the official resources for accessing technical documentation and summarizes the key operating specifications for the Besi Datacon 2200 evo series. Official Documentation Access
For the complete operations or maintenance manual, Besi (the manufacturer) requires users to access their secure portals. Technical documents for machines manufactured after 2020 are typically hosted in the Besi Webshop under the "Service Information System".
Customer Support: If you are based in Kenya and do not have login credentials, you must contact Besi Customer Support at sales@besi.com to request access to the Dedicated Datacon Customer Area.
Official Brochures: You can download high-level technical overviews and brochures directly from the Besi Products Page. Key Technical Specifications
The Datacon 2200 evo is a high-accuracy, multi-chip die bonder designed for flexibility in die attach and flip chip applications. Placement Accuracy: Standard/Plus: @ . Advanced: @ with a rotational accuracy of
±0.07∘plus or minus 0.07 raised to the composed with power .
Throughput: Up to 7,000 units per hour (UPH) for die attach. Component Handling: Wafer Size: 4" to 12" (50 mm to 300 mm). Die Size: 0.17 mm to 50 mm. Die Thickness: Down to 50 (thinner possible on request). Bond Force: Programmable from 0.5N to 25N.
Physical Dimensions: Approximately 1,160 mm x 1,225 mm x 1,800 mm, weighing roughly 1,300 kg. Core Features & Capabilities Datacon 2200 evo advanced - Product details | Besi
Downloads. Datacon 2200 evo advanced - brochure 2023.pdf. PDF - 4 MB. Besi Datacon 2200 evo hS - Product details | Besi datacon 2200 evo manual pdf kenya
While there is no single public "Datacon 2200 EVO Manual PDF" specifically tailored for Kenya, the original technical documentation and operation manuals from the manufacturer, Besi, are available through their official customer portal or professional document repositories. Official Documentation Access
The most reliable way to obtain the full text and technical manual is through the Besi Customer Area.
Customer Area: Access to detailed machine catalogs and technical manuals typically requires a personal login and password assigned by Besi Customer Support.
Besi Webshop: Technical documents and 2D/3D images for machines manufactured after 2020 are hosted here for registered users. Available Technical Resources (Online)
If you do not have official login credentials, several portions of the manual and technical specifications are hosted on professional sharing platforms:
SECS/GEM Manual: A 153-page comprehensive manual for the SECS/GEM 6.2 interface on the Datacon 2200 platform is available on Scribd.
Product Brochures & Data Sheets: High-level technical overviews for various models (Evo Advanced, Evo Plus, Evo hF) can be downloaded directly from the Besi Product Details page.
Features Overview: A detailed summary of machine highlights, bond head features, and dispensing systems is hosted on Scribd. Core Technical Specifications While there is no single public PDF document
The standard Datacon 2200 EVO platform generally includes the following specifications: Placement Accuracy: From ±10plus or minus 10 ±3plus or minus 3 for the "Advanced" model. Bond Force: Programmable from N on specialized hF models). Bond Temperature: Maximum substrate temperature of 350∘C350 raised to the composed with power cap C and bond head temperature of 450∘C450 raised to the composed with power cap C
Throughput: Up to 7,000 Units Per Hour (UPH) for die attach. Wafer Size: Supports 2" to 12" wafers (50 mm – 300 mm). Datacon 2200 evo advanced - Product details | Besi
Downloads. Datacon 2200 evo advanced - brochure 2023.pdf. PDF - 4 MB. Datacon 2200 evo advanced - Product details | Besi
Searching for a Datacon 2200 Evo manual in Kenya involves accessing resources from the manufacturer, Besi, as physical copies or localized downloads are typically managed through their global customer support portals. Where to Find the Datacon 2200 Evo Manual Besi Official Support (Global)
: The most reliable source for technical manuals and documentation is the Besi Customer Area
. You will likely need a professional login assigned by their customer support to access full operation manuals. DirectIndustry Catalogs
: You can view and download technical brochures and data sheets for the Datacon 2200 Evo Advanced Datacon 2200 Evo Plus which provide key specifications. Technical Overviews
: For a feature-rich overview that covers machine highlights and SiP specific features, you can refer to community-shared documents like the Besi Datacon 2200 EVO Features Overview on Scribd Key Specifications for Reference What to Look for in an Authentic Manual
If you are looking for specific technical details normally found in the manual, here are the core capabilities of the Datacon 2200 Evo: placement accuracy for advanced models.
: Supports die sizes from 0.17 mm to 50 mm and thicknesses from 0.05 mm to 7 mm. Working Area
: Maximum substrate working area of 13” x 8” (325 mm x 200 mm). bond head rotation with an optional heated head. Versatility
: Designed for Multi-Module Attach, Flip Chip, and SiP applications. Manufacturer Contact for Local Assistance
Since there is no dedicated Besi office in Kenya, localized support for the East Africa region is often handled through their APAC or European headquarters . You can reach out to their global sales team at sales@besi.com
to request a localized service partner or the specific PDF manual for your serial number. Messe Frankfurt for machine maintenance, or just the technical data sheet for equipment specifications? Datacon 2200 evo advanced - Product details | Besi
What to Look for in an Authentic Manual
If you are searching for the Datacon 2200 EVO manual PDF in Kenya, ensure the document (typically 200-400 pages) includes the following essential sections:
- Safety & Initial Setup: Voltage requirements (Kenyan standard 240V/50Hz), compressed air quality, and ESD (Electrostatic Discharge) safety protocols relevant to local conditions.
- Daily Maintenance Logs: Check sheets for cleaning the ejector pin, bond head, and conveyor rail.
- Error Code Dictionary: A full table of alarms—e.g., "Axis Z velocity error" or "Vacuum pressure low"—and their step-by-step recovery procedures.
- Spare Parts List (BOM): Local part numbers for filters, needles, and plungers that can be sourced from Kenyan industrial suppliers or imported via Mombasa port.
- Calibration Routine: The detailed process for bond force calibration and optical alignment, which is critical for yield in high-volume production.
Frequently Asked Questions (Kenya-Specific)
1. Safety and Installation (Crucial for Kenyan Power Conditions)
The manual includes specific guidelines for electrical grounding and voltage stabilization. Given the fluctuating power grids in some industrial zones, the manual advises on using certified UPS systems and surge protectors to prevent damage to the machine’s sensitive servo motors.